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Established 1992 in Silicon Valley. Comit provides complete chip, board and software engineering services to customers worldwide.
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Board Design
High speed boards require an experienced design vendor aware of signal integrity issues at gigahertz speeds.
Comit provides schematic capture, design and signal integrity analysis of multi-layered high speed analog digital mixed signal boards with 4 mil trace widths and sub 5 mil separations.
Design examples include hot-swappable 18-layer 4-mil PCB with 622-MHz clocks, LVDS, LVPECL, fiber-optic transponders, -48V supplies, DC/DC, PowerPC CPU, Xilinx, Altera & Triscend FPGAs, SONET Framers, TL1 command language support, OC-3/OC-12 Network Processor-based PCI-bus ATM/POS Network Interface Cards, 480 MHz Ultra-Sparc Hot-Swap Compact-PCI PCB, etc.
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Managed auxiliary services include layout, component procurement, fab, assembly and testing. Comit engineers can work with you to determine high speed signal management strategies and material selection issues for high-speed multilayer stackups.
Combined with Comit's chip design and embedded software development capabilities, you have the ability to finally implement a one-stop contracting strategy that minimizes third party interactions and enables faster turnarounds for your products.
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